Malaysian Pacific Industries Berhad is a Malaysia-based semiconductor company specializing in the assembly, packaging, and testing of integrated circuits. The company provides advanced semiconductor packaging solutions including leadframe-based, substrate-based, and advanced packaging technologies for global semiconductor customers. Its operations include high-volume manufacturing, process development, and testing services serving markets such as consumer electronics, automotive, industrial, and communications. Malaysian Pacific Industries operates manufacturing facilities in Malaysia and selected international locations, forming part of global semiconductor supply chains. The company's strategic focus emphasizes technology advancement, capacity expansion, operational excellence, and long-term partnerships with global semiconductor designers and manufacturers.
Headquarters
Level 31, Menara Hong Leong, No. 6, Jalan Damanlela, Bukit Damansara
Kuala Lumpur; Federal Territories;
Postal Code: 50490
Contact Details: Purchase the Malaysian Pacific Industries Bhd report to view the information.
Website: http://www.mpind.my
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