Chipbond Technology Corporation is a packaging and testing service provider in the semiconductor industry. Specializing in driver ICs and display driver ICs, the company offers solutions for bump, test, and assembly for ICs, as well as packaging and testing services for non-driver ICs. Chipbond has developed automated attachment equipment to supply various types of attachment materials and provides products such as Flexible Tape-and-Reel Circuit Substrate and Chip Trays for packaging purposes. Chipbond claims to have a global presence and is one of the top ten semiconductor packaging and testing companies.
Headquarters
No 3,Li Hsin 5 Rd.,Science-Based Industrial Park
Hsinchu City; Hsinchu City;
Contact Details: Purchase the Chipbond Technology Corporation (颀邦科技股份有限公司) report to view the information.
Website: http://www.chipbond.com.tw
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