Interflex Vina Co., Ltd. is a wholly Korean-invested electronics manufacturing subsidiary of Interflex Co., Ltd., operating as an important production base for flexible printed circuit technology in Vietnam. The company's core business is the manufacture and assembly of flexible printed circuit boards (FPCB) and related electronic interconnect components used in smartphones, displays, camera modules, touch and biometric modules, batteries, wearable devices, and increasingly in automotive electronics. Interflex Vina supports high-precision, high-volume output through integrated processes such as patterning, lamination, surface-mount assembly, module integration, functional testing, and final inspection aligned with Korean electronics quality systems. Its manufacturing assets are located in Vietnam's northern electronics corridor, enabling proximity to major global device makers' supply chains and efficient export logistics. Output is primarily export-oriented, shipping to Asian and global electronics customers through Interflex's international sales network, while also supporting localized demand from Vietnam-based electronics assemblers. Strategically, Interflex Vina is positioned to reinforce Interflex's global FPCB competitiveness through Vietnam-based scale, continuous miniaturization and high-frequency performance capability, productivity automation, and strict adherence to international quality, environmental, and delivery requirements.
Headquarters
Lot Cn5, Ba Thien Industrial Park, Thien Ke Commune
Ha Giang; North Eastern Vietnam;
Postal Code: 15000
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